Method of forming HCMOS devices with a silicon-germanium-carbon compound semiconductor layer

ABSTRACT

Si and SiGeC layers are formed in an NMOS transistor on a Si substrate. A carrier accumulation layer is formed with the use of a discontinuous portion of a conduction band present at the heterointerface between the SiGeC and Si layers. Electrons travel in this carrier accumulation layer serving as a channel. In the SiGeC layer, the electron mobility is greater than in silicon, thus increasing the NMOS transistor in operational speed. In a PMOS transistor, a channel in which positive holes travel, is formed with the use of a discontinuous portion of a valence band at the interface between the SiGe and Si layers. In the SiGe layer, too, the positive hole mobility is greater than in the Si layer, thus increasing the PMOS transistor in operational speed. There can be provided a semiconductor device having field-effect transistors having channels lessened in crystal defect.

This is a divisional of application Ser. No. 08/931,562, filed Sep. 16,1997.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor device, and moreparticularly to a semiconductor device having a heterojunctionfield-effect transistor using a SiGeC or SiGe layer, and to a method ofproducing this semiconductor device.

Recently, high integration of a semiconductor device is under way. It iseven intended to miniaturize a MOS transistor in which a gate length isbelow 0.1 μm. In such ultra-miniaturization, however, the currentdriving ability is saturated due to the influence of a short channeleffect or an increase in resistance component. Thus, there cannot beexpected such improvements in performance that have hitherto been made.In particular, to increase the driving ability of a miniaturized MOStransistor, it is important to improve the mobility of carriers in achannel and to lower a source-drain electrode in contact resistance.

In view of the foregoing, there has been proposed, instead of acomplementary semiconductor device (CMOS device) formed on a siliconsubstrate, a heterostructure CMOS device (hereinafter referred to as anHCMOS device) using Si/SiGe (mixed crystal of the IV-family elements).The HCMOS device utilizes, as a channel, the interface of aheterojunction structure of two kinds of semiconductors different inband gap from each other, instead of the Si/SiO₂ interface. By usingSi/SiGe capable of providing a carrier mobility higher than thatprovided by Si, it is expected to achieve a transistor higher inoperational speed. By controlling the composition of Si/SiGe, it ispossible to form, on a Si substrate, an epitaxial growth layer havingthe desired amount of strain and the desired value of band gap. Ismailof the IBM company has conducted basic experiments on improvements incharacteristics of an HCMOS device of the Si/SiGe type (See K. Ismail,“Si/SiGe High Speed Field-Effect Transistors”, IEDM Tech. Dig. 1995,p509 and M. A. Armstrong et al, “Design of Si/SiGe HeterojunctionComplementary Metal-Oxide Semiconductor Transistors”, IEDM Tech. Dig.1995, p761).

FIG. 15 is a section view of an example of this HCMOS device. As shownin FIG. 15, there is formed, on a portion of a Si substrate 101, afield-effect transistor comprising source-drain regions 109, a gateinsulating layer 107 and a gate electrode 110. Formed in a so-calledchannel region between the source-drain regions under the gate electrode110 are a SiGe buffer layer 102, a δ doped layer 115, a spacer layer103, an i-Si layer 104, an i-SiGe layer 105 and an i-Si layer 106. Inthese layers, the SiGe buffer layer 102 gives tensile strain to the i-Silayer 104 for forming an n-channel layer 112 between the SiGe bufferlayer 102 and the i-Si layer 104. In the SiGe buffer layer 102, the Gecomposition rate is gradually changed such that the Ge composition ratein that portion of the layer 102 immediately above the Si substrate 101is equal to 0%, while the Ge composition rate in the top portion of thelayer 102 is equal to 30%.

When a negative bias voltage is applied, the n-channel layer 112 isformed on the heterointerface between the i-Si layer 104 and the SiGebuffer layer 102 thereunder. The δ doped layer 115 is arranged to supplyelectrons serving as carriers to the n-channel layer 112 which is formedon the δ doped layer 115. The spacer layer 103 is arranged to spatiallyseparate the ions in the δ doped layer 115 formed below the spacer layer103, from the n-channel layer 112 formed on the spacer layer 103, thuspreventing the carrier mobility from being lowered due to ionscattering.

On the other hand, when a positive bias voltage is applied, a p-channellayer 111 is formed, at the side of the i-SiGe layer 105, on theheterointerface between the i-SiGe layer 105 and the i-Si layer 106thereon. The gate insulating layer 107 is formed to insulate the gateelectrode 110 from the p-channel layer 111.

As discussed in the foregoing, the heterojunction field-effecttransistor is characterized in that a channel is formed on theheterointerface between two kinds of semiconductor layers different inband gap from each other. Accordingly, to form a channel, there areinevitably present at least two kinds of semiconductor layers differentin band gap from each other. In addition, to form, in semiconductorlayers, a channel in which electrons or positive holes move at a highspeed, it is required to form, at the heterointerface, a discontinuousportion of a conduction or valence band. In the Si/SiGe typeabove-mentioned, the i-SiGe layer 105 has a discontinuous portion in thevalence band with respect to the i-Si layer 106, thus forming a channelfor positive holes (See the left portion of FIG. 15). However, theconduction band hardly has a discontinuous portion. Accordingly, tensilestrain is induced in the i-Si layer 104 such that a discontinuousportion is formed in the conduction band at the heterointerface betweeni-Si layer 104 and the i-SiGe layer 105 (See the right portion of FIG.15).

According to a simulation, it is estimated that, as compared with aconventional CMOS device in the same size using a Si/SiO₂ channel, theHCMOS device having the arrangement above-mentioned achieves anoperation at double the speed with a half power consumption. Morespecifically, this is a semiconductor transistor in which a Sisemiconductor is combined with a SiGe mixed crystal to form aheterointerface and in which there is formed a channel in which carriersare mobile at a high speed. Thus, attention is placed to thissemiconductor transistor as a transistor capable of achieving both ahigh-speed operation utilizing a heterojunction and large-scaleintegration of a MOS device.

A heterojunction device utilizing a mixed crystal of the IV-familyelements such as SiGe is expected as means for overcoming the functionallimit of a CMOS device of prior art. Due to the difficulty inproduction, however, a heterojunction field-effect transistor using amixed crystal of the IV-family elements represented by SiGe is behind inresearch and development as compared with a heterojunction bipolartransistor which is a heterodevice similarly using a mixed crystal suchas SiGe. Thus, it cannot be stated that studies have sufficiently bemade on the structure capable of providing performance as expected andon the method of producing such structure.

Further, in a heterojunction field-effect transistor having a so-calledheterojunction MOS structure having an insulating layer between a gateelectrode and a semiconductor layer as above-mentioned, a stable andgood insulating layer cannot be formed in the SiGe layer. Accordingly,an oxide layer of SiO₂ is used as a gate insulating layer. It istherefore required that a Si layer is always present immediately belowthe gate insulating layer. However, Si is characterized in that its bandgap is always greater than the band gap of SiGe. This is disadvantageousin the above-mentioned HCMOS device of prior art as set forth below.

Firstly, to form an electron channel on the Si substrate 101, tensilestrain is induced in the i-Si layer 104 to form a band discontinuousportion at the Si/SiGe heterointerface. However, the lattice constantundergoes a change to induce dislocation due to lattice relaxation.

FIG. 16 is a section view illustrating the SiGe buffer layer 102 and thei-Si layer 104 thereabove, as picked out from FIG. 15. Since the i-Silayer 104 is smaller in lattice constant than the SiGe buffer layer 102,tensile strain will be accumulated at the stage of crystal growth. Whensuch accumulation becomes great, this results in dislocation in the i-Silayer 104 as shown in FIG. 16. Thus, dislocation or line defect isinevitably induced by strain due to lattice misfit between the i-Silayer 104 and the SiGe buffer layer 102. Setting apart from the initialcharacteristics of a transistor utilizing such a crystal, it isconsidered that the reliability and life-time of the transistor areinfluenced by the deterioration in characteristics due to the growth ofdislocation in the crystal.

The SiGe buffer layer 102 made of SiGe greater in lattice constant thanSi is laminated on the Si substrate 101 and tensile strain isaccumulated in the i-Si layer 104 which is grown on the SiGe bufferlayer 102. As the thickness of the SiGe buffer layer 102 is increased,the thickness exceeds the critical thickness in which the latticeconstant of the SiGe buffer layer 102 is changed from the latticeconstant of Si to the original lattice constant of SiGe. This produceslattice relaxation, causing defects such as dislocation or the like tobe induced also in the SiGe buffer layer 102.

There are instances where such defects do not exert a significantinfluence on the initial characteristics of the transistor. In view oflong-term reliability and life-time, however, such defects involve apossibility of a serious trouble being caused. More specifically, thetransistor is deteriorated due to the growth of defects by an electriccurrent or the diffusion of metal or impurity through the defects, thuspossibly causing the transistor to be lowered in reliability.

Secondly, a heterojunction field-effect device using a mixed crystal ofthe IV-family elements represented by SiGe is effective as a transistorstructure capable of overcoming the performance limit of a miniaturizedCMOS device of prior art. At this point of time, however, studies onoptimization of the contact of each source-drain electrode have notsufficiently been done as compared with studies on improvements inchannel mobility. Thus, the structure cannot take full advantage of suchhigh-speed mobility. In the IBM's heterojunction CMOS device technologymentioned earlier, too, detailed studies have been made on improvementsin mobility of a channel region, but studies have hardly been made onreduction in resistance of the contact of each source-drain electrodewhich is another important factor for improvement in performance of aminiaturized transistor.

More specifically, in a CMOS device structure using a single crystal ofSi, a variety of studies have been made on the structure of the contactregion of the substrate connected to a source-drain electrode. However,studies are required as to whether or not the contact region structureand its production method which are optimized for a general CMOS device,are also good for a heterojunction field-effect device different intransistor structure.

SUMMARY OF THE INVENTION

It is a first object of the present invention to provide a semiconductordevice high in carrier mobility and reliability in which there isutilized, as a structure in a channel region under a gate of an HCMOSdevice, a heterojunction structure in lattice fit or substantially inlattice fit, yet having a band discontinuous portion where a carrieraccumulation layer can be formed.

It is a second object of the present invention to provide asemiconductor device having contact regions low in contact resistancewithout excellent characteristics of a heterostructure field-effectdevice injured, and to provide a method of producing the semiconductordevice above-mentioned.

To achieve the first object, the present invention provides a firstsemiconductor device, a second semiconductor device and a firstsemiconductor device producing method.

To achieve the second object, the present invention provides a thirdsemiconductor device and a second semiconductor device producing method.

The first semiconductor device according to the present inventioncomprises a field-effect transistor which is formed on a portion of asemiconductor substrate and which comprises a gate electrode,source-drain regions and a channel region between the source-drainregions, and the channel region comprises: a Si layer; aSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0<y≦1) which is formed as coming incontact with the Si layer and in which the composition rate y of C is inthe range from 0.01 to 0.03; and a carrier accumulation layer formed inthat portion of the Si_(1-x-y)Ge_(x)C_(y) layer which is adjacent to theSi layer.

At the interface between the Si layer and the Si_(1-x-y)Ge_(x)C_(y)layer in which the composition rate y of C is in the range from 0.01 to0.03, there can be formed a band discontinuous portion required forforming a carrier accumulation layer in which carriers aretwo-dimensionally confined. Since this carrier accumulation layerfunctions as a channel, there can be obtained a field-effect transistorhigh in operational speed in which the Si_(1-x-y)Ge_(x)C_(y) layergiving a higher carrier mobility than in the Si layer, serves as achannel. Further, control can be made such that lattice misfit betweenthe Si_(1-x-y)Ge_(x)C_(y) layer and the Si layer does not occur or isminimized. It is therefore possible to make an adjustment such thatlattice strain is not induced or substantially not induced. This enablesthe Si_(1-x-y)Ge_(x)C_(y) layer to be formed with no crystal defectinduced therein. Thus, a highly reliable semiconductor device can beobtained.

According to the present invention, the composition rates of therespective elements in the Si_(1-x-y)Ge_(x)C_(y) layer may be adjustedsuch that the Si_(1-x-y)Ge_(x)C_(y) layer and the Si layer are fitted inlattice for each other.

This enables a channel to be formed in the Si_(1-x-y)Ge_(x)C_(y) layerfree from strain due to lattice misfit. Thus, a highly reliablesemiconductor device can be obtained.

According to the present invention, provision may be made such that theSi_(1-x-y)Ge_(x)C_(y) layer has a lattice constant smaller than that ofthe Si layer and has such a thickness as to induce no latticerelaxation.

With the arrangement above-mentioned, tensile strain is induced in theSi_(1-x-y)Ge_(x)C_(y) layer. This increases the amount of a banddiscontinuous portion with respect to the Si layer, thus enhancing thecarrier confining efficiency.

According to the present invention, carriers accumulated in the carrieraccumulation layer may be negative.

According to the present invention, a carrier supply layer for supplyingcarriers to the carrier accumulation layer is preferably formed in thatportion of the Si layer which is adjacent to the Si_(1-x-y)Ge_(x)C_(y)layer.

Preferably, the present invention is arranged such that carriersaccumulated in the carrier accumulation layer are negative, that thereis formed another field-effect transistor which is formed on otherportion of the semiconductor substrate and which comprises a gateelectrode, source-drain regions and a channel region between thesource-drain regions, and that the channel region of anotherfield-effect transistor comprises: a second Si layer; a SiGe layerformed adjacent to the second Si layer; and a second carrieraccumulation layer for accumulating positive carriers, which is formedin that portion of the SiGe layer adjacent to the second Si layer.

With the arrangement above-mentioned, there can be obtained asemiconductor device functioning as an HCMOS device which assures a highcarrier mobility in each of the n-channel and p-channel sides.

According to the present invention, the Si_(1-x-y)Ge_(x)C_(y) or SiGelayer may be a quantum well region.

With the arrangement above-mentioned, there can be obtained afield-effect transistor having a channel high in carrier confiningefficiency.

According to the present invention, each of the source-drain regions maycomprise a first semiconductor layer and a second semiconductor layergreater in band gap than the first semiconductor layer, and there mayfurther be formed source-drain contact layers each of which is made of aconductive layer low in resistance and each of which is formedimmediately above the first semiconductor layer.

With the arrangement above-mentioned, a semiconductor device low incontact resistance can be obtained even with the use of a heterojunctionstructure.

The second semiconductor device according to the present inventioncomprises: a field-effect transistor which is formed on a portion of asemiconductor substrate and which comprises a gate electrode;source-drain regions; and a channel region between the source-drainregions, and the channel region comprises: a first Si layer; a firstSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0<y≦1) which is formed as coming incontact with the first Si layer; a second Si layer; a secondSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0≦y≦1) which is formed as coming incontact with the second Si layer and which is different in band gap fromthe first Si_(1-x-y)Ge_(x)C_(y) layer; and first and second carrieraccumulation layers for respectively confining different conductivecarriers, these first and second carrier accumulation layers beingrespectively formed in that portion of the first Si_(1-x-y)Ge_(x)C_(y)layer which is adjacent to the first Si layer and in that portion of thesecond Si_(1-x-y)Ge_(x)C_(y) layer which is adjacent to the second Silayer.

According to the arrangement above-mentioned, there can be obtained asemiconductor device functioning as an HCMOS device having n-channel andp-channel field-effect transistors each having a channel high not onlyin carrier confining efficiency but also in operational speed. Further,control can be made such that lattice misfit between the firstSi_(1-x-y)Ge_(x)C_(y) layer and the first Si layer does not occur or isminimized. This enables the first Si_(1-x-y)Ge_(x)C_(y) layer to beformed with no crystal defect induced therein. Thus, a highly reliablesemiconductor device can be obtained.

According to the present invention, the composition rate y of C in thesecond Si_(1-x-y)Ge_(x)C_(y) layer may be equal to 0.

According to the present invention, there may further be disposed a MOStransistor which is formed on the semiconductor substrate and in which asemiconductor layer formed of a single element serves as a channelregion.

With the arrangement above-mentioned, a transistor provided in thechannel region thereof with the first Si_(1-x-y)Ge_(x)C_(y) layer may beused for a circuit requiring a high operational speed, and a usual MOStransistor may be used for other circuit, thus enabling the applicablerange of the semiconductor device to be enlarged.

According to the present invention, provision may be made such that thefirst Si_(1-x-y)Ge_(x)C_(y) layer has a lattice constant smaller thanthat of the first Si layer and has such a thickness as to induce nolattice relaxation.

With the arrangement above-mentioned, tensile strain is induced in thefirst Si_(1-x-y)Ge_(x)C_(y) layer. This increases the amount of a banddiscontinuous portion with respect to the first Si layer, thus enhancingthe carrier confining efficiency.

According to the present invention, a carrier supply layer for supplyingcarriers to the first carrier accumulation layer is preferably formed inthat portion of the first Si layer which is adjacent to the firstSi_(1-x-y)Ge_(x)C_(y) layer.

The third semiconductor device according to the present inventioncomprises at least one field-effect transistor formed on a semiconductorsubstrate, and this field-effect transistor comprises: a channel regioncomprising a first semiconductor layer including a Si_(1-x-y)Ge_(x)C_(y)layer (0≦x≦1, 0≦y≦1), a second semiconductor layer different in band gapfrom the first semiconductor layer, and a carrier accumulation layerformed in the vicinity of the interface between the first and secondsemiconductor layers; source-drain regions each comprising: a thirdsemiconductor layer and a fourth semiconductor layer greater in band gapthan the third semiconductor layer; and source-drain contact layers eachof which is made of a conductive layer, each of which is low inresistance and each of which is formed immediately above the thirdsemiconductor layer.

The arrangement above-mentioned can lower the resistance of a contactwith respect to each source-drain region in the field-effect transistorhigh not only in carrier mobility but also in operational speed with theuse of a heterojunction structure.

The present invention may be arranged such that the first semiconductorlayer also serves as the third semiconductor layer, that the secondsemiconductor layer also serves as the fourth semiconductor layer, andthat the second semiconductor layer is formed on the first semiconductorlayer.

The present invention may be arranged such that the first and thirdsemiconductor layers are respectively formed by different semiconductorlayers, that the third semiconductor layer is formed on the firstsemiconductor layer, and that the fourth semiconductor layer is formedon the third semiconductor layer.

The first semiconductor device producing method according to the presentinvention, provides a method of producing a semiconductor deviceincluding an n-channel field-effect transistor and a p-channelfield-effect transistor, and comprises: a first step of forming, on asemiconductor substrate, a first Si layer and a firstSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0<y≦1) which comes in contact withthe first Si layer and in which a first carrier accumulation layerserving as a channel of the n-channel field-effect transistor is formedin that portion of the first Si_(1-x-y)Ge_(x)C_(y) layer which isadjacent to the first Si layer; a second step of forming, on thesemiconductor substrate, a second Si layer and a secondSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0≦y≦1) which comes in contact withthe second Si layer, which is different in band gap from the firstSi_(1-x-y)Ge_(x)C_(y) layer and in which a second carrier accumulationlayer serving as a channel of the p-channel field-effect transistor isformed in that portion of the second Si_(1-x-y)Ge_(x)C_(y) layer whichis adjacent to the second Si layer; a third step of depositing aconductive layer on the first or second Si_(1-x-y)Ge_(x)C_(y) layerwhichever is the upper, and patterning the conductive layer to form thegate electrodes of the n- and p-channel field-effect transistors; and afourth step of introducing, with the gate electrodes of the field-effecttransistors used as masks, (i) n-type impurity into the n-channelfield-effect transistor forming region in depth which reaches at leastthe first carrier accumulation layer and (ii) p-type impurity into thep-channel field-effect transistor forming region in depth which reachesat least the second carrier accumulation layer, thus formingsource-drain regions of the n- and p-channel field-effect transistors.

According to the method above-mentioned, the second semiconductor deviceof the present invention can readily be produced.

The second semiconductor device producing method of the presentinvention provides a method of producing a semiconductor device whichhas a first semiconductor layer including a Si_(1-x-y)Ge_(x)C_(y) layer(0≦x≦1, 0≦y≦1), a second semiconductor layer different in band gap fromthe first semiconductor layer and a carrier accumulation layer servingas a channel formed in the vicinity of the interface between the firstand second semiconductor layers, and which serves as a field-effecttransistor, and this second semiconductor device method comprises: afirst step of successively forming, on a field-effect transistor formingregion of a semiconductor substrate, a third semiconductor layer and afourth semiconductor layer greater in band gap than the thirdsemiconductor layer; a second step of depositing a conductive layer onthe fourth semiconductor layer and patterning the conductive layer toform a gate electrode; a third step of introducing impurity into thoseportions of the field-effect transistor forming region which are locatedat both lateral sides of the gate electrode, thus forming source-drainregions, the impurity being introduced in depth which reaches at leastthe carrier accumulation layer; a fourth step of etching the fourthsemiconductor layer in the source-drain regions until at least the thirdsemiconductor layer is exposed; and a fifth step of forming, on theexposed surface of the third semiconductor layer, source-drain contactlayers made of conductive layers low in resistance.

According to the method above-mentioned, the third semiconductor deviceof the present invention can readily be produced.

According to the present invention, the fourth step is preferablyexecuted under etching conditions in which the etching selectivity forthe third and fourth semiconductor layers is high.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 section view illustrating the structure of a SiGeC HCMOS deviceaccording to a first embodiment of the present invention;

FIG. 2 is a view illustrating the dependency of lattice strain of theSiGeC layer in the HCMOS device in FIG. 1 upon Ge and C concentrations;

FIG. 3 is a view illustrating the relationship among Si, Ge, Cconcentrations which produce a lattice fit or tensile strain between theSiGeC layer and the Si layer in the SiGeC HCMOS device in FIG. 1;

FIG. 4 is a view illustrating the relationship between an energy gapvalue and the C composition rate in the SiGeC layer in the HCMOS devicein FIG. 1;

FIG. 5 (a) to FIG. 5 (f) are section views illustrating the steps ofproducing a semiconductor device according to the first embodiment ofthe present invention;

FIG. 6 (a) to FIG. 6 (c) are views illustrating the relationshipsbetween strain due to lattice misfit and the composition of the SiGeClayer of a second embodiment of the present invention;

FIGS. 7(a) and 7(b) is a view illustrating the band lineup in alattice-fit SiGeC HCMOS device of the second embodiment of the presentinvention;

FIG. 8 is a section view illustrating the structure of an HCMOS devicehaving channels each in a quantum well structure according to a thirdembodiment of the present invention;

FIG. 9 (a) to FIG. 9 (f) are section views illustrating the steps ofproducing a semiconductor device according to the third embodiment ofthe present invention;

FIG. 10 is a section view illustrating the structure of an HCMOS deviceaccording to a fourth embodiment of the present invention;

FIG. 11 (a) to FIG. 11 (e) are section views illustrating the first halfof the steps of producing the HCMOS device according to the fourthembodiment of the present invention;

FIG. 12 (a) to FIG. 12 (e) are section views illustrating the secondhalf of the steps of producing the HCMOS device according to the fourthembodiment of the present invention;

FIG. 13 is a section view illustrating the structure of an HCMOS deviceaccording to a fifth embodiment of the present invention;

FIG. 14 is a section view illustrating the structure of an HCMOS deviceaccording to a sixth embodiment of the present invention;

FIG. 15 is a section view illustrating the structure of an HCMOS deviceof prior art; and

FIG. 16 shows defects induced in a heterointerface of the HCMOS deviceof prior art in FIG. 15, the defects including dislocation or the likeproduced by strain due to lattice misfit.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

First Embodiment

An HCMOS device according to a first embodiment of the present inventionis a field-effect transistor unit which uses a three-element mixedcrystal of SiGeC comprising C added to SiGe/Si, in which the SiGeC layerand the Si layer are substantially fitted in lattice for each other, andin which a band discontinuous portion is formed at a heterointerface dueto a difference in band gap energy.

FIG. 1 is a section view illustrating the structure of the HCMOS deviceof the first embodiment. As shown in FIG. 1, NMOS and PMOS transistorsare formed on a silicon substrate 10. The following description willfirst discuss the structure of the NMOS transistor.

In the NMOS transistor, a p-well 11 (high-concentration p-type siliconlayer) is formed on the silicon substrate 10. Successively formed on thep-well 11 are (i) a Si layer 13 n having a δ doped layer which has beendoped with a V-family element in high concentration, and a spacer layer,and (ii) a SiGeC layer 14 n (in which the C concentration is 4%, whilethe Ge concentration is 36%). As will be discussed later, thecomposition rates of the respective elements in the SiGeC layer 14 n areset such that the SiGeC layer 14 n and the Si layer 13 n immediatelytherebelow are fitted in lattice for each other.

In the heterointerface between the SiGeC layer 14 n and the Si layer 13n, there is present a band discontinuous portion of a conduction band Echaving a band offset value ΔEc, as shown in the right portion of FIG. 1.Formed at this band discontinuous portion is a carrier accumulationlayer in which electrons serving as negative carriers are confined astwo-dimensional electron gas (2DEG). The carrier accumulation layerformed in the vicinity of the interface at the side of the SiGeC layer14 n, will serve as a channel in which electrons travel at a high speed.In the SiGeC layer 14 n, the electron mobility is higher than in the Silayer, thus increasing the operational speed of this NMOS transistor.

Successively formed on the SiGeC layer 14 n are a SiGe layer 15 n (inwhich the Ge concentration is 30%, while the Si concentration is 70%),and a Si layer 17 n. A gate insulating layer 19 n comprising a siliconoxide layer is formed on the surface of the Si layer 17 n. Because theSi layer 17 n is present below the gate insulating layer 19 n, the gateinsulating layer 19 n high in crystallinity can readily be formed merelyby oxidizing the surface of the Si layer 17 n. A gate electrode 18 n isformed on the gate insulating layer 19 n. Source-drain layers 16 n areformed in the substrate at both lateral sides of the gate electrode 18n. The travel of electrons within the SiGeC layer 14 n is controlled bya voltage applied to the gate electrode 18 n. In FIG. 1, thesource-drain layers 16 n are formed in depth which reaches the p-well11, but may be formed at least in depth corresponding to that portion ofthe SiGeC layer 14 n which will result in a channel.

The PMOS transistor has substantially the same structure as that of theNMOS transistor discussed in the foregoing. An n-well 12(high-concentration n-type Si layer) is formed on the silicon substrate10. Successively formed on the n-well 12 are (i) a Si layer 13 p havinga δ doped layer which has been doped with a V-family element in highconcentration and (ii) a SiGeC layer 14 p (in which the Ge concentrationis 8.2%, while the C concentration is 1%). Further successively formedon the SiGeC layer 14 p are a SiGe layer 15 p (in which the Geconcentration is 30%, while the Si concentration is 70%) and a Si layer17 p. In the PMOS transistor, positive holes serve as carriers. Thechannel in which the positive holes travel, is formed at the side of theSiGe layer 15 p of the interface between the SiGe layer 15 p and the Silayer 17 p. A band discontinuous portion of the valence band having aband offset value ΔEv is present at the heterointerface between the SiGelayer 15 p and the Si layer 17 p. A carrier accumulation layer is formedat this discontinuous portion. Accordingly, the positive holes travel inthe channel of carrier accumulation layer formed at the side of the SiGelayer 15 p of the interface. In the SiGe layer 15 p, too, the mobilityof positive holes is higher than in the Si layer, thus increasing theoperational speed of the PMOS transistor.

In the PMOS transistor, a gate insulating layer 19 p comprising asilicon oxide layer is formed on the Si layer 17 p. Source-drain layers16 p are formed at both sides of a gate electrode 18 p. The travel ofpositive holes in the SiGe layer 15 p is controlled by a voltage appliedto the gate electrode 18 p.

Disposed between the NMOS and PMOS transistors is a trench isolation 20formed by embedding, with a silicon oxide layer, a groove formed in thesubstrate. The trench isolation 20 electrically separates the NMOS andPMOS transistors from each other.

The Si layers 13 n, 13 p, the SiGeC layers 14 n, 14 p, the SiGe layers15 n, 15 p, and the Si layers 17 n, 17 p are simultaneously formedthrough crystal growth. For example, the sizes of the respective layerscan be set to the following sizes, but are not limited thereto.

The thickness of each of the Si layers 13 n, 13 p is for example equalto about 0.6 μm, and is preferably in the range from 0 to 1 μm. Thethickness of each spacer layer is for example equal to about 30 nm, andis preferably in the range from 0 to 50 nm. The thickness of each of theSiGeC layers 14 n, 14 p is preferably in the range from 3 to 50 nm. Thethickness of each of the SiGe layers 15 n, 15 p is equal to about 5 nmand is preferably in the range from 3 to 5 nm. The thickness of each ofthe Si layers 17 n, 17 p is equal to about 1 nm and is preferably in therange from 0.5 to 5 nm. The thickness of each of the gate insulatinglayers 19 n, 19 p is for example about 5 nm.

In each of the gate electrodes 18 n, 18 p, the gate length is equal to0.25 μm and the gate width is equal to 2.5 μm. The width of eachsource-drain region is equal to about 1.2 μm. The contact area of eachof source-drain electrodes 21 n, 21 p is equal to about 0.5 μm×about 0.6μm. The doping concentration of each of the wells 13 n, 13 p is in therange from about 1×10¹⁷ to 1×about 10¹⁸ cm⁻³. The doping concentrationof each of the δ doped layers is in the range from about 1×10¹⁸ to about1×10²⁰ cm⁻³.

The HCMOS device (Heterostructure CMOS device) of this embodiment ischaracterized in that a SiGeC layer is used. By adjusting thecomposition rates of Si, Ge and C in the SiGeC layer, the band gapamount and lattice misfit with respect to silicon can be changed. Thefollowing description will discuss in detail the relationship betweenthe composition rates of Si, Ge and C and each of the strains and bandoffset amounts of the layers in the first embodiment.

FIG. 2 shows how the lattice misfit (%) between the SiGeC layer and theSi layer changes with the concentrations (%) of C and Ge respectivelyshown on the axis of abscissa and the axis of ordinate. The misfit zeroline represents that the SiGeC layer and the Si layer are equal inlattice constant to each other. The lattice constant of a single crystalof Ge (germanium) is greater than that of a single crystal of Si, andthe lattice constant of a single crystal of C (carbon) is smaller thanthat of a single crystal of Si. Accordingly, by adjusting thecomposition rates of Ge and C, the lattice constant of the SiGeC layer14 n can be made equal to that of the Si layer 13 n.

FIG. 3 is a characteristic view illustrating the relationship betweenthe composition rates of three elements Si, Ge, C and lattice fit. InFIG. 3, the three apexes represent the points where the respectiveconcentrations of Si, Ge, C are equal to 100% (the composition rates areequal to 1). Thus, FIG. 3 shows how the lattice misfit with respect toSi changes by adjusting the composition of three-element mixed crystalof the SiGeC layer. In FIG. 3, the hatched zone is a composition zonewhich gives tensile strain to the SiGeC layer, and the solid line showsthe conditions of composition of the respective elements under which thelattice misfit between the SiGeC layer and the Si layer is zero or underwhich the SiGeC layer and the Si layer are fitted in lattice matched foreach other. The lattice constant of Ge is greater by 4.2% than that ofSi, and the lattice constant of C is smaller by 34.3% than that of Si.Accordingly, by increasing the composition rate of Ge by 8.2 times ofthe composition rate of C, the lattice constant of the SiGeC layer canbe agreed with the lattice constant of the Si layer.

In the SiGeC layer 14 n of the first embodiment, the Ge concentration isequal to 8.2% (x=0.082) and the C concentration is equal to 1% (y=0.01).Accordingly, it is understood from FIG. 3 that the lattice misfit of theSiGeC layer 14 n with respect to the Si substrate is zero and that theSiGeC layer 14 n and the Si layer 13 n therebelow have the same latticeconstant.

FIG. 4 shows how the band offset value ΔEc of the conduction band andthe band offset value ΔEv of the valence band at the interface betweenthe SiGeC layer and the Si layer, are changed with the composition rateof C and the energy level respectively shown on the axis of abscissa andthe axis of ordinate. In FIG. 4, the black circles show the band offsetvalues ΔEv of the valence band and the white circles show the bandoffset values ΔEc of the conduction band. In FIG. 4, the original pointof the energy is set to the energy value at the lower end of theconduction band of Si for the conduction band, and to the energy valueat the upper end of the valence band of Si for the valence band. In FIG.4, the solid lines correspond to the layer in which no strain isinduced, while the dotted lines correspond to the layer in which tensilestrain is induced.

As shown in FIG. 4, it is understood in the first embodiment that theband offset values of the conduction and valence bands at the respectiveinterfaces between the SiGeC layer (in which the composition rate of Cis equal to 0.01) and the Si layer, are respectively 300 meV and 0 meV,and that at the interface between the SiGeC layer and the Si layer, adiscontinuous portion is not formed in the valence band, but is formedonly in the conduction band. In the SiGeC layer 14 n of the firstembodiment, the composition rate of C is equal to 0.01. Accordingly, theSiGeC layer 14 n and the Si layer 13 n are fitted in lattice for eachother. This prevents a defect such as dislocation or the like from beinginduced in the SiGeC layer 14 n having a channel in whichtwo-dimensional electron gas travels. That is, if the SiGeC layer 14 nand the Si layer 13 n therebelow are misfitted in lattice for eachother, such a defect is induced in the SiGeC layer 14 n.

In the first embodiment, a discontinuous portion is not formed in thevalence band at the interface between the SiGeC layer 14 n and the Silayer 13 n. Accordingly, positive holes cannot be confined in the SiGeClayer 14 n. Therefore, the PMOS transistor using positive holes ascarriers, utilizes a heterojunction between the SiGe layer 15 p and theSi layer 17 p. The lattice constant of the single crystal of SiGe isgreater than that of the single crystal of Si, and the SiGe layer 15 pis located above the SiGeC layer 14 p fitted in lattice for the Si layer13 p. Accordingly, the band offset value in the valence band is largebecause of changes in band structure due to compressive strain. In thiscase, too, when an electric field is applied from the gate, positiveholes are two-dimensionally confined (2DHG) by band inclination, thusforming a carrier accumulation layer. Therefore, the carrieraccumulation layer in the SiGe layer 15 p will result in a channel inwhich the positive holes travel at a high speed.

According to the structure of the first embodiment discussed in theforegoing, the NMOS transistor is arranged such that, by adjusting thecomposition rates of the respective elements Si, Ge, C of the SiGeClayer 14 n, the SiGeC layer 14 n can be fitted in lattice for the Silayer 13 n while maintaining the band offset value of the conductionband at a value sufficient to accumulate two-dimensional electron gas.Thus, the NMOS transistor can achieve a high-speed operation utilizingthe high carrier mobility of the two-dimensional electron gas in theSiGeC layer, yet providing a high reliability by reducing the defectdensity. Since no discontinuous portion is formed in the valence band atthe interface between the SiGeC layer 14 n and the Si layer 13 n, thepositive holes cannot be confined in the SiGeC layer 14 n. However, byutilizing a heterojunction between the SiGe layer 15 p and the Si layer17 p, there can be formed a channel for the PMOS transistor usingpositive holes as carriers, thus achieving a high-speed operation.

By integrating the NMOS transistor high in speed with the PMOStransistor high in speed using SiGe to form band discontinuous portionin the valence band, there can be achieved a high-performance HCMOSdevice.

In the first embodiment, the Ge concentration is equal to 8.2% and the Cconcentration is equal to 1%. However, it is understood from FIG. 4that, to maximize the band discontinuous portion or band offset valueΔEv in the lattice-fit type, it is enough to increase the compositionrate of C. When such a large band offset value ΔEv is provided, thetwo-dimensional electron gas (2DEG) confined in the heterointerface doesnot get over the heterointerface but travels in a stable manner eventhough the electron concentration is high. In particular, thecomposition rate of C is preferably in the range from 0.01 to 0.03. Inthis range, there can be obtained, in both the non-strain and tensilestrain types, a proper band offset value ΔEv (=−0.2 to −0.6) for forminga carrier accumulation layer in which the two-dimensional electron gasis to be confined.

In the first embodiment, the Ge concentration in the SiGe layer 15 p isset to 30%. To increase the band offset value, however, the Geconcentration may be increased to increase the compressive strain.

Since the HCMOS device is formed on a Si substrate, the HCMOS device maybe used for a circuit in which high speed is required, while a usualCMOS device formed on an active region having a single composition of Simay be used for other circuit. Thus, the HCMOS device having thearrangement above-mentioned can be integrated with a MOS field-effecttransistor directly formed on a Si substrate. As a device using SiGeC,p- and n-type transistors are not necessarily formed on the samesubstrate. Accordingly, the following measure may be taken, for example,for an integrated circuit used for a mobile communication device. Thatis, an amplifier, a mixer or the like used in a high frequency region inwhich a high-speed operation is required, is not required to form acomplementary circuit. Therefore, such an amplifier, a mixer or the likeis formed of a MOS transistor using SiGeC of only one of the p- andn-types (for example, the n-type). A component which is arranged toexecute a digital signal processing and which is required to form acomplementary circuit, may be formed of a CMOS device using a singlecomposition of Si.

Referring to FIG. 5 (a) to FIG. 5 (f), the following description willdiscuss a method of producing the HCMOS device of the first embodiment.FIG. 5 (a) to FIG. 5 (f) are section views illustrating an example ofthe process for producing the HCMOS device shown in FIG. 1.

At the step shown in FIG. 5 (a), the p- and n-wells 11, 12 are formed,by ion injection, on the silicon substrate 10.

At the step shown in FIG. 5 (b), the Si layer 13 including the δ dopedlayer, the SiGeC layer 14 (Ge: 8.2%, C: 1%), the SiGe layer 15 and theSi layer 17 are grown on the wells 11, 12 using a UHV-CVD method. The δdoped and spacer layers which are actually formed, are omitted in FIG. 5for convenience' sake.

At the step shown in FIG. 5 (c), to electrically separate the PMOS andNMOS transistors from each other, a groove for trench isolation isformed and then embedded with a silicon oxide layer, thus forming thetrench isolation 20. This divides the Si layer 13, the SiGeC layer 14,the SiGe layer 15 and the Si layer 17 n into (i) the Si layer 13 n, theSiGeC layer 14 n, the SiGe layer 15 n and the Si layer 17 n for the NMOStransistor and (ii) the Si layer 13 p, the SiGeC layer 14 p, the SiGelayer 15 p and the Si layer 17 p for the PMOS transistor. Then, thesurfaces of the Si layers 17 n, 17 p are oxidized to form the gateinsulating layers 19 n, 19 p.

At the step shown in FIG. 5 (d), a polysilicon layer is deposited on thewhole surface of the substrate and then patterned to form the gateelectrodes 18 n, 18 p on the gate insulating layers 19 n, 19 p of theNMOS and PMOS transistors. With each of the gate electrodes 18 n, 18 pused as a mask, phosphorous ions (P+) are injected to form thesource-drain layers 16 n at the NMOS transistor side and boron ions (B+)are injected to form the source-drain layers 16 p at the NMOS transistorside. It is sufficient that the depth of the source-drain layers 16 n ofthe NMOS transistor is deeper than at least the carrier accumulationlayer in the SiGeC layer 14 n, and that the depth of the source-drainlayers 16 p of the PMOS transistor is deeper than at least the carrieraccumulation layer in the SiGe layer 15 p. This is because channels arerespectively formed in the carrier accumulation layers in the SiGeClayer 14 n and the SiGe layer 15 n.

At the step shown in FIG. 5 (e), openings are formed in those portionsof the gate insulating layers 19 n, 19 p above the source-drain layers16 n, 16 p.

At the step shown in FIG. 5 (f), the source-drain electrodes 21 n, 21 pare formed at the openings in the gate insulating layers 19 n, 19 p.

Thus formed on the Si substrate 10 is an HCMOS device comprising theNMOS and PMOS transistors.

According to the production method of the first embodiment, differentchannels are required to be formed in the NMOS and PMOS transistors.However, the crystals can simultaneously be grown for both the NMOS andPMOS transistors. Thus, the HCMOS device can readily be produced.

Second Embodiment

According to the first embodiment, a field-effect transistor is formedusing a SiGeC layer fitted in lattice for silicon. However, the secondembodiment provides a transistor in which, within the range where thecrystallinity is not deteriorated, strain is positively induced in aSiGeC layer and changes in band structure due to such strain areutilized. The second embodiment provides an HCMOS device in which thePMOS and NMOS transistors according to the first embodiment in FIG. 1are realized in a single transistor.

FIG. 6 (a) to FIG. 6 (c) are views respectively illustrating a crystalstructure in which compressive strain is induced in the SiGeC layer, acrystal structure in which the SiGeC layer is fitted in lattice for theSi layer (with no strain induced) and a crystal structure in whichtensile strain is induced in the SiGeC layer. As shown in FIG. 6 (a),when the lattice constant of the SiGeC layer is larger than that of theSi layer, compressive strain is induced in the SiGeC layer to increasethe band gap value between the lower end of the conduction band and theupper end of the valence band in the SiGeC layer. On the other hand, asshown in FIG. 6 (c), when the lattice constant of the SiGeC layer issmaller than that of the Si layer, tensile strain is induced in theSiGeC layer to reduce the band gap between the lower end of theconduction band and the upper end of the valence band in the SiGeClayer. More specifically, the strain of the SiGeC layer causes the bandstructure to be changed. Thus, such effect can positively be utilized tochange the band offset value of the Si layer or the like adjacent to theSiGeC layer.

Even though the lattice constant of the SiGeC layer is shifted from thelattice constant of the Si layer, it is possible to effectively preventthe transistor from being lowered in reliability due to the occurrenceof crystal defects such as dislocation or the like, by setting thethickness of the SiGeC layer to such a level that no lattice relaxationoccurs and that strain is accumulated.

FIG. 7 (a) and FIG. 7 (b) are, respectively, a view of band structureand a section view of a channel region of the field-effect transistor ofthe second embodiment. By growing a Si layer 13 n on a Si substrate andthen growning a SiGeC layer 14 n (Ge: 10%, C: 4%) in which thecomposition rate of C is being increased, the SiGeC layer 14 n can bearranged such that its band gap value is large and its lattice constantis small. Then, the thickness of the SiGeC layer 14 n is reduced to suchan extent that no lattice relaxation occurs and strain is accumulated.Accordingly, tensile strain is induced in the SiGeC layer 14 n. Inaddition to the effect of increasing the band gap value due to anincrease in the composition rate of C, the tensile strain in the SiGeClayer 14 n increases the band offset value in the conduction band at theinterface between the SiGeC layer 14 n and the Si layer 13 n. Thisimproves the efficiency at which two-dimensional electron gas (2DEG) isconfined.

Further, since the SiGeC layer 14 n is not relaxed in lattice, thelattice constant of the top thereof is identical with the latticeconstant of the Si layer 13 n. Accordingly, when a SiGe layer 15 p isgrown on the SiGeC layer 14 n, compressive strain is induced in the SiGelayer 15 p because the lattice constant of the SiGe layer 15 p is largerthan that of the Si layer 13 n.

According to the semiconductor device of the second embodiment, tensilestrain is induced in the SiGeC layer 14 n and compressive strain isinduced in the SiGe layer 15 p. Accordingly, the band offset value ofthe conduction band at the interface between the SiGeC layer 14 n andthe Si layer 13 n is large, and the band offset value of the valenceband at the interface between the SiGe layer 15 p and the Si layer 17 pis large. When this transistor is used as an NMOS transistor, a channelformed in the SiGeC layer 14 n may be utilized. When this transistor isused as a PMOS transistor, a channel formed in the SiGe layer 15 p maybe utilized. Thus, there can be formed an HCMOS device having channelsdifferent in position, while having a common gate electrode and commonsource-drain regions.

By properly setting the thickness of each of the layers, there can beobtained an HCMOS device having a field-effect transistor unit which isfree from dislocation or defect due to lattice misfit and which is highin reliability resulting from good crystallinity.

The broken lines in FIG. 4 show the composition in which tensile strainof 0.25% is induced in the SiGeC layer 14 n in the second embodiment.Generally, when the composition rate of Ge in the SiGeC layer is 8.2times of the composition rate of C, the SiGeC layer is fitted in latticefor the Si layer. Accordingly, when the composition rate of Ge issmaller than 8.2 times of the composition rate of C, tensile strain canbe induced in the SiGeC layer 14 n. It is now supposed that thecomposition rate of C is set to y. When the Ge composition is set to(8.2y−0.12), the lattice constant of the SiGeC layer 14 n can be madesmaller by 0.25% than that of the Si layer 13 n.

As shown in FIG. 4, likewise in the non-strain type, a banddiscontinuous portion is not formed in the valence band at the interfacebetween the SiGeC layer 14 n and the Si layer 13 n, and is formed onlyin the conduction band. When the C concentration is not greater than 2%,the band offset value of the conduction band is substantially equal tothat of the non-strain type. Thus, even though the ratio of the Cconcentration to the Ge concentration deviates from the value satisfyingthe condition of lattice fit, there can be obtained transistorcharacteristics substantially equal to those of the lattice-fit type.This means that a certain latitude is allowed in the condition in viewof control of C concentration and Ge concentration when growing theSiGeC layer 14 n. This facilitate the crystal growth of the SiGeC layer.When the C concentration is not less than 2%, the band offset value canbe made greater than in the non-strain type with the same Cconcentration. It is therefore possible to comply with a circuitrequiring a greater band offset value.

The second embodiment is arranged such that the lattice constant ofSiGeC is smaller than that of Si. However, since the thickness of theSiGeC layer is set such that no lattice relaxation is induced and strainis accumulated, there is no possibility of the transistor being loweredin reliability due to crystal defect such as dislocation or the like.

Third Embodiment

According to the first embodiment mentioned earlier, there is formed, atthe channel region of each field-effect transistor, a heterostructure inwhich the SiGeC layer is fitted in lattice for the Si layer, andelectrons or positive holes are confined in the band discontinuousportion at the heterointerface such that the electrons or positive holesare used as carriers.

According to a third embodiment, there is formed a transistor in which acarrier confining region is not formed at a heterointerface, and inwhich a quantum well structure of Si/SiGeC or Si/SiGe/Si is formed suchthat a quantum well (SiGeC, SiGe) held by and between barrier layersserves as a channel.

FIG. 8 is a section view of an HCMOS device according to the thirdembodiment. This HCMOS device has a CMOS-device structure in which NMOSand PMOS transistors are formed on a Si substrate 30. This structure inFIG. 8 is the same as that of the HCMOS device in FIG. 1 in that ap-well 31 and an n-well 32 are formed on the Si substrate 30 and thatthere are respectively formed, on the p- and n-wells 31, 32, first Silayers 33 n, 33 p each having a δ doped layer doped with a V-familyelement in high concentration. However, the PMOS and NMOS transistors onthe first Si layers 33 n, 33 p are different from those in the firstembodiment.

In the NMOS transistor, a SiGeC layer 34 n having such a composition asto fit in lattice for the first Si layer 33 n, is formed on the first Silayer 33 n, and a second Si layer 35 n is laminated on the SiGeC layer34 n. In the third embodiment, a quantum well region (SiGeC layer 34 n)held by and between two band discontinuous portions is present in theconduction band extending over the first Si layer 33 n, the SiGeC layer34 n and the second Si layer 35 n. Accordingly, a carrier accumulationlayer for confining two-dimensional electron gas (2DEG) serving as acarrier is formed in the SiGeC layer 34 n which is a quantum well region(See the band illustration at the right hand in FIG. 8). Morespecifically, a channel is formed in the SiGeC layer 34 n when the NMOStransistor is operated. A thin SiGe layer 36 n and a third Si layer 37 nare successively formed on the second Si layer 35 n.

According to the arrangement above-mentioned, likewise in the firstembodiment, a channel for moving carriers is formed in the SiGeC layer34 n higher in electron mobility than the Si layer. Thus, there can beobtained an NMOS transistor high in operational speed. In addition,since the SiGeC layer 34 n serving as a quantum well layer is thin, thethird embodiment is improved in carrier confining efficiency as comparedwith the first embodiment and can be achieved using a layer small inmixed-crystal ratio. This restrains factors of deteriorating themobility of electrons serving as a carriers. The factors include carrierscattering due to the deterioration in regularity of the crystalstructure resulting from mix-crystallization.

The PMOS transistor is the same as the NMOS transistor in that there aresuccessively formed, on the first Si layer 33 p, a SiGeC layer 34 phaving such a composition as to fit in lattice for the first Si layer 33p, a second Si layer 35 p, a thin SiGe layer 36 p and a third Si layer37 p. In the PMOS transistor, however, there is formed a quantum wellregion (SiGe layer 36 p) held by and between two band discontinuousportions in the valence band extending over the second Si layer 35 p,the SiGe layer 36 p and the third Si layer 37 p, and there is formed, inthe quantum well region, a carrier accumulation layer fortwo-dimensionally confining positive holes serving as carriers. Morespecifically, when the PMOS transistor is operated, a channel is formedin the SiGe layer 36 p. In the SiGe layer 36 p, too, the mobility ofpositive holes is higher than in the Si layer. This enables the PMOStransistor to be operated at a high speed.

In the NMOS and PMOS transistors, gate insulating layers 39 n, 39 pcomprising silicon oxide layers are formed on the substrate, and gateelectrodes 38 n, 38 p are formed on the gate insulating layers 39 n, 39p. Source-drain layers 42 n, 42 p are formed at the both sides of thegate electrodes 38 n, 38 p, and source-drain electrodes 41 n, 41 p comein contact with the tops of the source-drain layers 42 n, 42 p. It is amatter of course that, in the NMOS and PMOS transistors, the respectivetravels of electrons and positive holes in the SiGeC layer 34 n and theSiGe layer 36 p are controlled by voltages respectively applied to thegate electrodes 38 n, 38 p.

Formed between the NMOS and PMOS transistors is a trench isolation 40formed by embedding an isolation groove with a silicon oxide layer. Thistrench isolation 40 electrically separates the NMOS and PMOS transistorsfrom each other.

Likewise in the first embodiment, the HCMOS device of the thirdembodiment has the SiGeC layer 34 n which is fitted in lattice for theSi layer and which serves as a quantum well region, and there is formed,in the SiGeC layer 34 n, a channel in which electrons travel. The SiGelayer 36 p serving as a quantum well region is formed in the PMOStransistor and there is formed in the SiGe layer 36 p a channel in whichpositive holes travel. Accordingly, a high-performance HCMOS can beachieved by integrating the NMOS and PMOS transistors each high inswitching speed using a quantum well structure high in carrier confiningefficiency.

According to the third embodiment, the HCMOS device may be used for acircuit in which high speed of a transistor is required, while a usualCMOS device formed on a Si substrate may be used for other circuit.Also, the HCMOS device can be integrated with a MOS field-effecttransistor directly formed on a Si substrate.

The channels of both the NMOS and PMOS transistors are not necessarilyformed in the quantum well regions.

Referring to FIG. 9 (a) to FIG. 9 (f), the following description willdiscuss a method of producing the HCMOS device according to the thirdembodiment. FIG. 9 (a) to FIG. 9 (f) are section views illustrating anexample of a production process for embodying the HCMOS device shown inFIG. 8.

First, an outline of the production process will be given. When growingthe SiGeC layer 34, the second Si layer 35 and the SiGe layer 36, thethickness of each of the SiGeC layer 34 and the SiGe layer 36 is madenot greater than 10 nm, for example 3 nm, such that each of the layers34, 36 serves as a quantum well structure. Other portions are formed atsteps similar to those shown in FIG. 5 (a) to FIG. 5 (f).

At the step shown in FIG. 9 (a), the p-well 31 and the n-well 32 areformed on the Si substrate 30 by ion injection.

At the step shown in FIG. 9 (b), there are successively grown, on the p-and n-wells 31, 32, a first Si layer 33 including a δ doped layer, aSiGeC layer 34 (Ge: 36%, C: 4%), a second Si layer 35, a SiGe layer 36and a third Si layer 37, using a UHV-CVD method.

At the step shown in FIG. 9 (c), to electrically separate the PMOS andNMOS transistors, a trench isolation groove is formed and then embeddedwith a silicon oxide layer for forming the trench isolation 40. Thisdivides the first Si layer 33, the SiGeC layer 34, the second Si layer35, the SiGe layer 36, the third Si layer 37 and the gate insulatinglayer 39, into (i) the first Si layer 33 n, the SiGeC layer 34 n, thesecond Si layer 35 n, the SiGe layer 36 n and the third Si layer 17 nfor the NMOS transistor and (ii) the first Si layer 33 p, the SiGeClayer 34 p, the second Si layer 35 p, the SiGe layer 36 p and the thirdSi layer 37 p for the PMOS transistor. Then, the surfaces of the thirdSi layers 37 n, 37 p are oxidized to form the gate insulating layers 39n, 39 p.

At the step shown in FIG. 9 (d), the gate electrodes 38 n, 38 p areformed. Then, the source-drain regions 42 n are formed by injection ofphosphorous ions (P+) for the NMOS transistor, and the source-drainregions 42 p are formed by injection of boron ions (B+) for the PMOStransistor. It is sufficient that the depth of the source-drain regions42 n of the NMOS transistor is deeper than the depth of at least theSiGeC layer 34 n and that the depth of the source-drain regions 42 p ofthe PMOS transistor is deeper than the depth of at least the SiGe layer36 p. This is because channels are respectively formed in the SiGeClayer 34 n and the SiGe layer 36 p.

At the step shown in FIG. 9 (e), the gate insulating layers 39 n, 39 pare patterned to form openings in those portions of the gate insulatinglayers 39 n, 39 p above the source-drain regions 42 n, 42 p.

At the step shown in FIG. 9 (e), the source-drain electrodes 41 n, 41 pare formed at the openings thus formed.

With the steps above-mentioned, there is formed an HCMOS devicecomprising the NMOS and PMOS transistors according to the thirdembodiment.

According to the production method of the third embodiment, there isreadily formed an HCMOS device in which the channel in the NMOStransistor is formed by the SiGeC layer 34 n of the quantum wellstructure utilizing a heterojunction, and in which the channel in thePMOS transistor is formed by the SiGeC layer 36 p of the quantum wellstructure utilizing a heterojunction. Further, according to theproduction method of the third embodiment, different channels arerequired to be formed for the NMOS and PMOS transistors. However,crystals can simultaneously be grown for both the NMOS and PMOStransistors. Thus, the HCMOS device can readily be produced.

Fourth Embodiment

FIG. 10 is a section view illustrating the structure of a field-effecttransistor according to a fourth embodiment of the present invention.This fourth embodiment provides a structure having a source-draincontact suitable for a heterojunction field-effect transistor.

As shown in FIG. 10, there are formed, on a well 51 made of a Si layer,a SiGe buffer layer 52, a δ doped layer 53, a spacer layer 54, ann-channel layer 67, an i-Si layer 55, an i-Si_(1-x)Ge_(x) layer 56, ani-Si layer 57 and a gate insulating layer 58. A gate electrode 65 isformed on the gate insulating layer 58. Source-drain contact W layers 61and Al source-drain electrodes 63 are successively formed on thei-S_(1-x)Ge_(x) layer 56 at both lateral sides of the gate electrode 65.At both sides of the gate electrode 65, source-drain regions 59 areformed as extending over a portion of the SiGe buffer layer 52, the δdoped layer 53, the spacer layer 54, the n-channel layer 67, the i-Silayer 55, the i-Si_(1-x)Ge_(x) layer 56 and the i-Si layer 57. A firstinsulating layer 66 is embedded in the space between the gate electrode65 and the Al source-drain electrodes 63.

The following description will discuss the structure of the field-effecttransistor above-mentioned.

In the SiGe buffer layer 52, the Ge concentration is increased in thevertical direction from the lower end of the layer 52 toward the upperend thereof. The SiGe buffer layer 52 has a thickness sufficient torelax the SiGe mixed crystal in lattice and therefore has a latticeconstant larger than that of Si. Thus, using a strain effect, ann-channel can be formed on the SiGe buffer layer 52. When, without usingsuch a SiGe buffer layer relaxed in lattice, there is formed aheterojunction of Si and SiGe layers with the Si layer fitted in latticefor the Si substrate, a great discontinuous portion increased in leveldifference is formed in the valence band, but a discontinuous portion ishardly formed in the conduction band. It is therefore difficult toconfine two-dimensional electron gas to form an n-channel.

The Ge concentration in the SiGe buffer layer 52 changes, for example,from 0% to 30% continuously or gradually in steps of thin layerportions. At this time, provision is made such that lattice relaxationoccurs in each layer portion and that the lattice constant of the SiGebuffer layer 52 at its top layer portion is identical with the latticeconstant of the original single crystal Si_(0.7)Ge_(0.3). The object ofchanging the concentration in the vertical direction of the layer 52, isto minimize the influence of a crystal defect exerted on a channelthereon, the crystal defect including dislocation or the like caused bylattice relaxation. The entire thickness of the SiGe buffer layer 52 isrequired to be about 1 μm.

Formed on the SiGe buffer layer 52 is the spacer layer 54 made ofSi_(0.7)Ge_(0.3) including no impurity. A carrier accumulation layer isformed at a discontinuous portion of a conduction band which is formedat the heterointerface between the spacer layer 54 and the i-Si layer 55thereon. This carrier accumulation layer serves as the n-channel 67 inwhich electrons are two-dimensionally confined.

The δ doped layer 53 is a layer doped with a V-family element such as Por As in high concentration for supplying electrons serving as carriersto the n-channel 67. The spacer layer 54 on the δ doped layer 53 iscomposed of Si_(0.7)Ge_(0.3) doped with no impurity, and spatiallyseparates the carrier electrons in the n-channel 67 from the ions in theδ doped layer 53 from each other. This lowers the scattering of thecarrier electrons by the ions, thus improving the mobility. As thespacer layer 54 is increased in thickness, the carrier scattering effectby ionized impurity is lowered. However, as the spacer layer 54 isincreased in thickness, the carrier density is lowered. Therefore, thethickness of the spacer layer 54 is preferably set to about 3 nm.

The i-Si_(1-x)Ge_(x) layer 56 and the i-Si layer 57 form a leveldifference in the valence band at the heterointerface to form ap-channel 68. Here, x is preferably set to about 0.7.

The gate insulating layer 58 insulates the gate electrode 65 from thesemiconductor layer therebelow to lower the gate leakage current, thusenabling the transistor to be lowered in power consumption. An oxidelayer formed by oxidizing the i-Si_(1-x)Ge_(x) layer 56 is water-solubleand unsteady. Therefore, in the SiGe field-effect transistor, too, asilicon oxide layer is preferably used as a gate insulating layer. In aSi heterojunction MOS device, therefore, the semiconductor layerimmediately below the gate insulating layer is preferably a Si layer.

More specifically, each of the field-effect transistors according to thefourth embodiment comprises a channel region formed by the laminationlayers above-mentioned, the source-drain regions 59 shown by the brokenlines in FIG. 10, the Al source-drain electrodes 63 for introducing andtaking out an electric current for operating the transistor, and thegate electrode 65 for applying a voltage for controlling the electriccurrent. When this field-effect transistor is to be used as an n-channelfield-effect transistor, a voltage is applied to the gate electrode 65such that the n-channel 67 is formed. When this field-effect transistoris to be used as a p-channel field-effect transistor, a voltage isapplied to the gate electrode 65 such that the p-channel 68 is formed.

The fourth embodiment is characterized by comprising channel regions,source-drain regions and source-drain contact layers. The channelregions comprise a first semiconductor layer including aSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0≦y≦1), a second semiconductor layerdifferent in band gap from the first semiconductor layer, and a carrieraccumulation layer formed in the vicinity of the interface between thefirst and second semiconductor layers. The source-drain regions comprisea third semiconductor layer and a fourth semiconductor layer greater inband gap than the third semiconductor layer. The source-drain contactlayers are made of conductive layers which are low in resistance andwhich are formed immediately above the third semiconductor layer.

When using the field-effect transistor according to the fourthembodiment as an n-channel field-effect transistor, the i-Si layer 55serves as the first semiconductor layer (x=y=0) including aSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0≦y≦1), the SiGe buffer layer 52serves as the second semiconductor layer, the i-Si_(1-x)Ge_(x) layer 56serves as the third semiconductor layer, the i-Si layer 57 serves as thefourth semiconductor layer greater in band gap than the i-Si_(1-x)Ge_(x)layer 56, and the source-drain contact W layers 61 are formedimmediately above the i-Si_(1-x)Ge_(x) layer 56 serving as the thirdsemiconductor layer.

When using the field-effect transistor according to the fourthembodiment as a p-channel field-effect transistor, the i-Si_(1-x)Ge_(x)layer 56 serves as the first semiconductor layer (y=0) including aSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0≦y≦1) and also as the thirdsemiconductor layer, the i-Si layer 57 serves as the secondsemiconductor layer and also as the fourth semiconductor layer greaterin band gap than the third semiconductor layer, and the source-draincontact W layers 61 are formed immediately above the i-Si_(1-x)Ge_(x)layer 56 serving as the third semiconductor layer.

As discussed in the foregoing, this embodiment is arranged such thatthose regions of the substrate which come in contact with the Alsource-drain electrodes 63, are formed in a semiconductor layer which issmaller in band gap out of the semiconductor layers for forming achannel. The fourth embodiment is arranged such that, at theheterointerface between the i-Si layer 57 and the i-Si_(1-x)Ge_(x) layer56 for forming the p-channel, the source-drain contact W layers 61 areformed immediately above the i-Si_(1-x)Ge_(x) layer 56 smaller in bandgap. As compared with the arrangement in which the source-drain contactW layers 61 are formed immediately above the uppermost semiconductorlayer or i-Si layer 57, this reduces the contact resistance, enablingthe transistor to be operated at a high speed with lower powerconsumption.

When metal (Al in this case) is deposited after W has been grown on theSi_(0.7)Ge_(0.3) layer on the Si layer, contacts very low in resistancecan be obtained. Such contacts using the SiGe layer are lower inresistance by one digit than low-resistance contacts obtained using asilicide technology which are generally used as low-resistance contactsin a CMOS device of prior art (IEEE Electron Device Letters, Vol. 17,No. 7, 1996 pp 360).

According to the paper above-mentioned, the SiGe layer is grown forforming source-drain electrode contacts. However, when the contacts areformed on the SiGe layer for channel formation as done in the fourthembodiment, it is not required to newly grow a SiGe crystal to improvethe productivity, as will be apparent in the transistor producing methodto be discussed later.

According to the fourth embodiment, the HCMOS device may be used for acircuit in which high speed of a transistor is required, while a usualCMOS device formed on a Si substrate may be used for other circuit. SuchHCMOS device can be integrated with a MOS field-effect transistordirectly formed on a Si substrate.

The following description will discuss a method of producing thefield-effect transistor according to the fourth embodiment. FIG. 11 (a)to FIG. 11 (e) and FIGS. 12 (a) to (e) are section views illustrating anexample of the steps of producing the field-effect transistor shown inFIG. 10.

At the step shown in FIG. 11 (a), prior to epitaxial growth for channelformation, the p- and n-wells 51 n, 51 p serving as the groundworks ofNMOS and PMOS transistors are formed on a silicon substrate 50 by ioninjection.

At the step shown in FIG. 11 (b), prior to epitaxial growth on thesubstrate, the substrate is cleaned using an RCA cleaning method or thelike, thereby to remove impurity on the surface. Thereafter, the surfaceoxide layer is removed and the substrate is then inserted into anepitaxial growth apparatus. In a vacuum, the substrate is heated toobtain a clean surface. Through epitaxial growth, semiconductor layersfor forming a channel region are formed on the clean surface. Thesesemiconductor layers include the SiGe buffer layer 52, the δ doped layer53, the spacer layer 54, the n-channel 67, the i-Si layer 55, thei-Si_(1-x)Ge_(x) layer 56, the p-channel 68, the i-Si layer 57 and thelike. For convenience' sake, the δ doped layer 53, the spacer layer 54,the n-channel 67 and the p-channel 68 are not shown. The followingdescription will discuss how the respective semiconductor layers areformed.

As a method of growing semiconductor layers, there can be used an MBEmethod using a solid source and a UHV-CVD method using a gas source.According to the UHV-CVD method, the atmosphere in the apparatus isfirst brought to a super-low gas pressure (about 10⁻¹⁰ Torr). After asource necessary for crystal growth is introduced into the vacuumcontainer, a crystal is grown in a vacuum when the degree of vacuumreaches about 10⁻⁵˜10⁻⁶ Torr.

According to the fourth embodiment, too, when the degree of vacuum inthe vacuum container becomes sufficiently low after a clean surface isformed on the substrate by the method above-mentioned, the substratetemperature is set to about 500˜about 700° C. for growth ofsemiconductor crystal layers. Changes in substrate temperature exert aninfluence upon the crystal quality such as changes in composition rateof a single semiconductor crystal layer. Accordingly, the substratetemperature is basically not changed while a single layer is beinggrown. When the substrate temperature becomes not less than 800° C.,interdiffusion of Ge and Si occurs. This is disadvantageous in view ofdeterioration in sharpness and strain relaxation to deteriorate thechannel characteristics. Therefore, the growth temperature is set to notgreater than 700° C. as mentioned earlier.

Crystal growth is conducted by introducing source gas necessary forcrystal growth into a vacuum container brought to a super-low gaspressure. As the source gas for crystal growth, disilane is used forgrowth of a Si layer. For growing a SiGe layer, germane is used as a Gesource gas in addition to the source gas such as disilane for growing aSi layer. At this time, by adjusting the ratio of partial pressures ofthe respective source gases, the composition rates of Si and Ge in theSiGe layer can be controlled. The gas flow amount is adjusted such thatthe degree of vacuum is in the range of about 10⁻⁵˜about 10⁻⁶ Torr.

First, a plurality of SiGe layer portions in which the composition ratesare being gradually changed and which are being relaxed in lattice, arelaminated to form the SiGe buffer layer 52. To gradually change thecomposition rate, the ratio of the partial pressures of the Si sourcegas and the Ge source gas is gradually changed.

To form the δ doped layer 53, a dopant gas such as arsine or phosphineis introduced into the vacuum container together with disilane andgermane.

If impurity introduced into the δ doped layer 53 is mixed with thespacer layer 54, the transistor is deteriorated in characteristics.Accordingly, after the dopant gas is introduced into the vacuumcontainer, the supply of the source gas is once stopped. After thedegree of vacuum is sufficiently lowered, the gas for growing the spacerlayer 54 is then introduced for growing the spacer layer 54. Provisionis made such that the spacer layer 54 has a uniform composition ofSi_(0.7)Ge_(0.3). The spacer layer 54 is grown with the disilane andgermane flow amounts fixed.

After the growth of the spacer layer 54, the supply of the source gas isstopped. After the degree of vacuum is sufficiently lowered, onlydisilane is introduced into the growth chamber for growing the i-Silayer 55 doped with no impurity.

After the growth of the i-Si layer 55, disilane and germane are againintroduced into the growth chamber for growing the i-Si_(1-x)Ge_(x)layer 56. The Ge concentration is set to 70%. After the growth of thei-Si_(1-x)Ge_(x) layer 56, the supply of the source gas is once stopped.Then, after the degree of vacuum is sufficiently lowered, only disilaneis introduced into the growth chamber for growing the i-Si layer 57.

With the foregoing, the process of epitaxially growing the semiconductorlayers forming a channel region is finished.

At the step shown in FIG. 11 (c), the substrate is taken out from theUHV-CVD apparatus and introduced into a thermal oxidation furnace wherethe surface of the uppermost i-Si layer 57 is oxidized to form the gateinsulating layer 58 made of a silicon oxide layer.

At the step shown in FIG. 11 (d), gate electrodes 65 n, 65 p are formedon the gate insulating layer 58. The gate electrodes 65 n, 65 p areformed in a manner similar to that in a CMOS device of prior art. Morespecifically, a polysilicon layer is deposited and, after impurity isintroduced by ion injection, the polysilicon layer is patterned to formthe gate electrodes 65 n, 65 p by dry-etching. Ions of boron fluoride(BF 2+) can be used as impurity ions. At the stage where the polysiliconlayer for gate electrodes is deposited, the source-drain regions are notformed yet.

At the step shown in FIG. 11 (e), with the gate electrodes 65 n, 65 pserving as masks, impurity ions serving as a dopant are injected intothe substrate to form the source-drain regions 59 n, 59 p. Then, etchingis conducted to remove the oxide layer exposed onto the substrate forforming contacts. At the time of ion injection, the ion acceleratingvoltage is selected such that the peak of impurity distribution islocated in the contact layers which come in contact with source-drainelectrodes. As impurity ions to be injected, ions of arsenic (As+) orphosphorous (P+) of the n-type impurity are used for the NMOS transistorregion, and boron ions (B+) of the P-type impurity are used for the PMOStransistor region. It is therefore required to conduct, usingrespectively different masks, ion injection for forming the source-drainregions 59 n for the NMOS transistor and ion injection for forming thesource-drain regions 59 p for the PMOS transistor.

Immediately after ion injections, an annealing processing is executedfor activating the impurity. It is however preferable to execute RTA(rapid thermal annealing) for a short period of time (30 seconds) atabout 1000° C. such that no interdiffusion of Si and Ge occurs at theheterointerface and that no defect is induced in a crystal in the courseof relaxation of strain present in the Si/SiGe type.

At the step shown in FIG. 12 (a), a photoresist mask (not shown) isformed again on the substrate and the region between the NMOS transistorforming region and the PMOS transistor forming region is excavated indepth deeper than at least the channel region, thus forming a transistorisolation groove 71.

At the step shown in FIG. 12 (b), a first insulating layer 72 isdeposited on the entire surface of the substrate including the groove71. To avoid the execution of a high-temperature process, it ispreferable to use a TEOS layer or the like which can be formed at atemperature of not greater than 500° C. using a plasma CVD method. Atthis time, a trench isolation 73 is formed by the insulating layerembedded in the groove 71.

The source-drain contacts which constitute a characteristic feature ofthe fourth embodiment, are then formed in the following steps. However,the steps of forming the structure in FIG. 10 are not limited to thefollowing steps.

To maximize the effect produced by the fourth embodiment, there isrequired the presence of a specific very thin semiconductor layer whichultimately serves as the ground of the contacts. In this connection,i-Si_(1-x)Ge_(x) layers 56 n, 56 p are selected as the specificsemiconductor layer serving as the ground, and the substrate is etcheduntil the i-Si_(1-x)Ge_(x) layers 56 n, 56 p are exposed. To expose thei-Si_(1-x)Ge_(x) layers 56 n, 56 p, it is preferable to applywet-etching high in selectivity. However, the wet-etching is poor inanisotropy and is not suitable for micro-machining. It is thereforepreferable to execute wet-etching after executing dry-etching toselectively remove those regions of the first insulating layer 72 atwhich source-drain electrodes will be formed, thus forming contact holesto cause gate insulating layers 58 n, 58 p to be exposed. The followingsteps may be conducted as an example of such a process.

To remove the uppermost oxide layer (gate insulating layers 58 n, 58 p),a solution of the hydrofluoric acid type is used as well known. Wheni-Si layers 57 n, 57 p are exposed, the etchant of the hydrofluoric acidtype which hardly removes silicon, is changed to an etchant capable ofremoving the i-Si layers 57 n, 57 p. According to the fourth embodiment,contacts are formed in the i-Si_(1-x)Ge_(x) layers 56 n, 56 p below thei-Si layers 57 n, 57 p. Accordingly, there is selected an etchant whichhardly etches the i-Si_(1-x)Ge_(x) layers 56 n, 56 p but selectivelyetches the i-Si layers 57 n, 57 p. Using this etchant, the i-Si layers57 n, 57 p are removed and the i-Si_(1-x)Ge_(x) layers 56 n, 56 p areexposed. At this time, portions of the i-Si_(1-x)Ge_(x) layers 56 n, 56p may be removed due to over-etching. As mentioned earlier, thei-Si_(1-x)Ge_(x) layers 56 n, 56 p are formed through epitaxial growthfor forming an n-channel in the channel region of the NMOS transistor.Accordingly, the fourth embodiment eliminates a step of growing newi-Si_(1-x)Ge_(x) layers 56 n, 56 p for forming contacts low inresistance using SiGe layers.

To form contacts, a metallic layer low in resistance is deposited on theexposed i-Si_(1-x)Ge_(x) layers 56 n, 56 p. When tungsten (W) is used asthe metallic material of the metallic layer, there can be formedcontacts extremely low in resistance. According to the fourthembodiment, with the temperature set to 400° C., source-drain contact Wlayers 61 n, 61 p are selectively grown on the i-Si_(1-x)Ge_(x) layers56 n, 56 p using, as a source gas, gas obtained by diluting WF6 byhydrogen.

At the step shown in FIG. 12 (e), the substrate is subjected tosputtering to cause an Al alloy layer to be deposited on the wholesurface of the substrate, and is then patterned to form Al source-drainelectrodes 63 n, 63 p. With the steps above-mentioned, contacts low inresistance can be formed on the source-drain regions.

As mentioned earlier, a Si heterojunction MOS device uses a siliconoxide layer as a gate insulating layer. Accordingly, the uppermostsemiconductor layer is preferably a Si layer having a great band gap.Thus, the technology of forming a contact metallic layer after asemiconductor layer has been removed as done in the fourth embodiment,is particularly suitable for forming a Si heterojunction MOS device.

Fifth Embodiment

In the fourth embodiment, there is taken, as a representative example, achannel structure using a heterojunction of Si and SiGe. The inventionin which contacts low in resistance are formed in source-drain regionsof an HCMOS device, is not limited to the fourth embodiment. Accordingto the invention, there may be used a channel formed between Si and aheteroepitaxial lamination layer having a structure other than thelamination structure of SiGe in the fourth embodiment. For example,there may be used a channel formed between Si and a mixed crystalsemiconductor of Si_(1-x-y)Ge_(x)C_(y) (0≦x≦1, 0≦y≦1). To form a channelat the heterointerface, two kinds of semiconductors different in bandgap are always required. Accordingly, the formation of such a contactlayer low in resistance is effective.

FIG. 13 is a section view of an HCMOS device according to a fifthembodiment in which metallic contact layers low in resistance are formedin the structure shown in FIG. 1.

As shown in FIG. 13, the HCMOS device of the fifth embodiment hassource-drain contact W layers 25 n, 25 p on SiGe layers 15 n, 15 p.

Likewise the fourth embodiment, the fifth embodiment has the followingcharacteristic feature in addition to the characteristic features of thefirst embodiment. That is, the fifth embodiment comprises channelregions, source-drain regions and source-drain contact layers. Thechannel regions comprise a first semiconductor layer including aSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0≦y≦1), a second semiconductor layerdifferent in band gap from the first semiconductor layer, and a carrieraccumulation layer formed in the vicinity of the interface between thefirst and second semiconductor layers. The source-drain regions comprisea third semiconductor layer and a fourth semiconductor layer greater inband gap than the third semiconductor layer. The source-drain contactlayers are made of conductive layers which are low in resistance andwhich are formed immediately above the third semiconductor layer.

In the NMOS transistor in the fifth embodiment, a SiGeC layer 14 nserves as the first semiconductor layer including aSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0≦y≦1), a Si layer 13 n serves asthe second semiconductor layer, the SiGe layer 15 n serves as the thirdsemiconductor layer, a Si layer 17 n serves as the fourth semiconductorlayer greater in band gap than the SiGe layer 15 n, and the source-draincontact W layer 25 n is formed immediately above the SiGe layer 15 nserving as the third semiconductor layer.

In the PMOS transistor of the fifth embodiment, the SiGe layer 15 pserves as the first semiconductor layer (y=0) including aSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0≦y≦1) and also as the thirdsemiconductor layer, a Si layer 17 p serves as the second semiconductorlayer and also as the fourth semiconductor layer greater in band gapthan the third semiconductor layer, and a source-drain contact W layer25 p is formed immediately above the SiGe layer 15 p serving as thethird semiconductor layer.

As discussed in the foregoing, this embodiment is arranged such thatthose regions (source-drain contact W layers 25 n, 25 p) of thesubstrate which come in contact with the Al source-drain electrodes 21n, 21 p, are formed in a semiconductor layer which is smaller in bandgap out of the semiconductor layers for forming a channel. This reducesthe contact resistance as compared with the arrangement in which thecontacts are formed immediately above the uppermost Si layers 17 n, 17p. Thus, the device can be operated at a high speed with lower powerconsumption.

In particular, the source-drain contact W layers 25 n, 25 p made oftungsten (W) are so formed as to come in contact with the SiGe layers 15n, 15 p. Thus, the source-drain contact W layers 25 n, 25 p areextremely low in contact resistance.

That is, the fifth embodiment can be arranged to lower the contactresistance, yet producing the effects produced by the first embodiment.

Sixth Embodiment

FIG. 14 is a section view of an HCMOS device according to a sixthembodiment in which metallic contact layers low in resistance are formedin the structure shown in FIG. 8.

As shown in FIG. 14, the HCMOS device has source-drain contact W layers45 n, 45 p on SiGe layers 36 n, 36 p which are quantum well regions.

Likewise the fourth embodiment, the sixth embodiment has the followingcharacteristic feature in addition to the characteristic features of thethird embodiment. That is, the sixth embodiment comprises channelregions, source-drain regions and source-drain contact layers. Thechannel regions comprise a first semiconductor layer including aSi_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0≦y≦1), a second semiconductor layerdifferent in band gap from the first semiconductor layer, and a carrieraccumulation layer formed in the vicinity of the interface between thefirst and second semiconductor layers. The source-drain regions comprisea third semiconductor layer and a fourth semiconductor layer greater inband gap than the third semiconductor layer. The source-drain contactlayers are made of conductive layers which are low in resistance andwhich are formed immediately above the third semiconductor layer.

In the NMOS transistor in the sixth embodiment, a SiGeC layer 34 n whichis a quantum well region, serves as the first semiconductor layerincluding a Si_(1-x-y)Ge_(x)C_(y) layer (0≦x≦1, 0≦y≦1), a first Si layer33 n serves as the second semiconductor layer, the SiGe layer 36 n whichis a quantum well region serves as the third semiconductor layer, athird Si layer 37 n serves as the fourth semiconductor layer greater inband gap than the SiGe layer 36 n, and the source-drain contact W layer45 n is formed immediately above the SiGe layer 36 n serving as thethird semiconductor layer.

In the PMOS transistor of the sixth embodiment, a SiGe layer 36 p servesas the first semiconductor layer (y=0) including a Si_(1-x-y)Ge_(x)C_(y)layer (0≦x≦1, 0≦y≦1) and also as the third semiconductor layer, a thirdSi layer 37 p serves as the second semiconductor layer and also as thefourth semiconductor layer greater in band gap than the thirdsemiconductor layer, and a source-drain contact W layer 45 p is formedimmediately above the SiGe layer 36 p serving as the third semiconductorlayer.

As discussed in the foregoing, the sixth embodiment is arranged suchthat those regions (source-drain contact W layers 45 n, 45 p) of thesubstrate which come in contact with the Al source-drain electrodes 41n, 41 p, are formed in a semiconductor layer which is smaller in bandgap out of the semiconductor layers for forming a channel. This reducesthe contact resistance as compared with the arrangement in which thecontacts are formed immediately above the Si layers 37 n, 37 p which arethe uppermost semiconductor layers. Thus, the device can be operated ata high speed with lower power consumption.

In particular, the source-drain contact W layers 45 n, 45 p made oftungsten (W) are so formed as to come in contact with the SiGe layers 36n, 36 p. Thus, the source-drain contact W layers 45 n, 45 p areextremely low in contact resistance.

That is, the sixth embodiment can be arranged to lower the contactresistance, yet producing the effects produced by the third embodiment.

Other Modifications

In each of the first to sixth embodiments, the description has been madeof a MOS field-effect transistor unit having a gate insulating layerbelow a gate electrode. However, the present invention is not limited tosuch embodiments. In particular, a field-effect transistor unit using aheterointerface instead of a heterojunction MOS structure having aninsulating layer at the uppermost layer, can form even a device whichdoes not use an insulating layer but uses a Schottky junction. Thisenables the resistance to be lowered and is advantageous in view of ahigh-speed operation with low power consumption.

In each of the first to sixth embodiments, the δ doped layers areformed. However, the present invention is not limited to such anarrangement. That is, the effects of the present invention can beproduced with the use of no δ doped layers. Even though the δ dopedlayers are formed, spacer layers are not necessarily required.

A SiGeC layer containing a trace amount of C may be formed instead ofeach of the SiGe layers in the first, second, third, fifth and sixthembodiments.

In each of the first, second, third, fifth and sixth embodiments, theSiGeC layers may be disposed above the SiGe layers. In such anarrangement, the source-drain contact W layers may be formed immediatelyabove the SiGeC layers in the source-drain regions.

What is claimed is:
 1. A method of producing a semiconductor deviceincluding an n-channel field-effect transistor and a p-channelfield-effect transistor, comprising: a first step of forming a first Silayer on a semiconductor substrate; a second step of forming a firstSi_(1-x-y)Ge_(x)C_(y) layer (o<x<1, o<y<1) which comes in contact withthe upper surface of said first Si layer and is free from strain due tolattice misfit with said first Si layer, and in which a first carrieraccumulation layer serving as a channel of said n-channel field effecttransistor is formed; a third step of forming, on said firstSi_(1-x-y)Ge_(x)C_(y) layer, a second Si_(1-x-y)Ge_(x)C_(y) layer(o<x<1, o<y<1) which is different in band gap from said firstSi_(1-x-y)Ge_(x)C_(y) layer and in which a second carrier accumulationlayer serving as a channel of said p-channel field-effect transistor isformed: a fourth step of forming a second Si layer which is in contactwith the upper surface of said second Si_(1-x-y)Ge_(x)C_(y) layer; afifth step of successively depositing, on said second Si layer, a gateinsulating layer and a conductive layer, and patterning said conductivelayer to form gate electrodes of said n- and p-channel field effecttransistors; and a sixth step of introducing, with said gate electrodesof said field-effect transistors used as masks, (i) n-type impuritiesinto said second Si layer and said first and secondSi_(1-x-y)Ge_(x)C_(y) layers in the n-channel field-effect transistorforming region in depth which reaches at least said first carrieraccumulation layer and (ii) p-type impurities into said second Si layerand said second Si_(1-x-y)Ge_(x)C_(y) layer in the p-channelfield-effect transistor forming a region at a depth which reaches atleast said second carrier accumulation layer, thus forming source-drainregions of said n- and p-channel field-effect transistors.
 2. A methodof producing a semiconductor device including a field-effect transistor,comprising: a first step of forming, on a substrate, a firstsemiconductor layer including a Si_(1-x-y)Ge_(x)C_(y) layer (0<x≦1,0≦y≦1); a second step of forming a second semiconductor layer whichcomes in contact with the upper surface of said first semiconductorlayer and is different in band gap from said first semiconductor layer,and in which a carrier accumulation layer serving as a channel of saidfield-effect transistor is formed in a portion which is adjacent to saidfirst semiconductor layer; a third step of depositing a conductive layeron said second semiconductor layer and patterning said conductive layerto form a gate electrode; a fourth step of introducing impurities intothose portions of a field-effect transistor forming region which arelocated at both lateral sides of said gate electrode, thus formingsource-drain regions, said impurities being introduced to a depth whichreaches at least said carrier accumulation layer; a fifth step ofremoving said second semiconductor layer in said source-drain regions byetching until at least said first semiconductor layer is exposed; and asixth step of forming, on the exposed surface of said firstsemiconductor layer, source-drain contact layers made of conductivelayers.
 3. A method of producing a semiconductor device including afield-effect transistor comprising: a first step of forming, a firstsemiconductor layer on a substrate; a second step of forming a secondsemiconductor layer including a Si_(1-x-y)Ge_(x)C_(y) layer (0≦x<1,0≦y<1) which comes in contact with the upper surface of said firstsemiconductor layer and is different in band gap from said firstsemiconductor layer, and in which a carrier accumulation layer servingas a channel of said field-effect transistor is formed in a portionwhich is adjacent to said first semiconductor layer; a third step offorming a third semiconductor layer on said second semiconductor layer;a fourth step of forming a fourth semiconductor layer which comes incontact with the upper surface of said third semiconductor layer and isgreater in band gap than said third semiconductor layer; a fifth step ofdepositing a conductive layer on said fourth semiconductor layer andpatterning said conductive layer to form gate electrodes; a sixth stepof introducing impurities into those portions of said first, second,third, and fourth semiconductor layers which are located at both lateralsides of said gate electrode, thus forming source-drain regions, saidimpurities being introduced to a depth which reaches at least saidcarrier accumulation layer; a seventh step of removing said fourthsemiconductor layer in said source-drain regions by etching until atleast said third semiconductor layer is exposed; and an eighth step offorming, on the exposed surface of said third semiconductor layer,source-drain contact layers made of conductive layers.
 4. A method ofproducing a semiconductor device including an n-channel field-effecttransistor and a p-channel field-effect transistor, comprising: a firststep of forming a first Si layer on a semiconductor substrate; a secondstep of forming a first Si_(1-x-y)Ge_(x)C_(y) layer (0<x<1, 0≦y<1) whichcomes in contact with the upper surface of said first Si layer and isfree from strain due to lattice misfit with said first Si layer, and inwhich a second carrier accumulation layer serving as a channel of saidp-channel field-effect transistor is formed; a third step of forming, onsaid first Si_(1-x-y)Ge_(x)C_(y) layer, a second Si_(1-x-y)Ge_(x)C_(y)layer (0<x<1, 0<y<1) which is different in band gap from said firstSi_(1-x-y)Ge_(x)C_(y) layer and in which a second carrier accumulationlayer serving as a channel of said n-channel field-effect transistor isformed; a fourth step of forming a second Si layer which is in contactwith the upper surface of said second Si_(1-x-y)Ge_(x)C_(y) layer; afifth step of depositing, on said second Si layer, a gate insulatinglayer and a conductive layer in order, and patterning said conductivelayer to form gate electrodes of said n- and p-channel field effecttransistors; and a sixth step of introducing, with said gate electrodesof said field-effect transistors used as masks, (i) p-type impuritiesinto said second Si layer and said first and secondSi_(1-x-y)Ge_(x)C_(y) layers in the p-channel field-effect transistorforming region in depth which reaches at least said first carrieraccumulation layer and (ii) n-type impurities into said second Si layerand said second Si_(1-x-y)Ge_(x)C_(y) layer in the n-channelfield-effect transistor forming a region at a depth which reaches atleast said second carrier accumulation layer, thus forming source-drainregions of said n- and p-channel field-effect transistors.
 5. A methodof producing a semiconductor device including a field-effect transistor,comprising: a first step of forming a first semiconductor layer on asubstrate; a second step of forming a second semiconductor layer whichcomes in contact with the upper surface of said first semiconductorlayer and is greater in band gap than said first semiconductor layer; athird step of forming a third semiconductor layer including aSi_(1-x-y)Ge_(x)C_(y) layer (0<x≦1, 0≦y≦1) on said second semiconductorlayer; a fourth step of forming a fourth semiconductor layer which comesin contact with the upper surface of said third semiconductor layer andis greater in band gap than said third semiconductor layer and in whicha carrier accumulation layer serving as a channel of said field-effecttransistor is formed in a portion of said third semiconductor layerwhich is adjacent to said fourth semiconductor layer; a fifth step ofdepositing a conductive layer on said fourth semiconductor layer andpatterning said conductive layer to form gate electrodes; a sixth stepof introducing impurities into those portions of said first, second,third, and fourth semiconductor layers which are located at both lateralsides of said gate electrode, thus forming source-drain regions, saidimpurities being introduced to a depth which reaches at least saidcarrier accumulation layer; a seventh step of removing said fourthsemiconductor layer in said source-drain regions by etching until atleast said third semiconductor layer is exposed; and an eighth step offorming, on the exposed surface of said third semiconductor layer,source-drain contact layers made of conductive layers.